What are the SMT processing measures for LED light strips?

Production Process:

A. When printing solder paste, try not to allow tin connections between the pads to prevent soldering short circuits caused by poor printing.

B. Prevent short circuit when patching

C. Check the patch position before reflow

D. After reflow, perform an appearance inspection first to ensure that there is no short circuit in the light strip before conducting an electrical re-inspection. During the re-inspection, pay attention to whether the LED is abnormally bright or dark after it is lit.

It is also worth noting that SMT processing of LED light strips is a relatively simple product in electronic product OEM. Many OEM technical engineers easily take it lightly, often causing batch quality accidents.

The following are some points that foundry technical engineers need to pay attention to:

1. The lamp beads and resistors need to be baked in the oven for 4-8 hours.

2. The furnace temperature must be tested, and different plate thicknesses must be treated differently to prevent cold welding accidents.

3. The most fatal and common quality problem in SMT processing of LED products is the generation of tin beads. It is very necessary to prepare steel mesh to prevent tin beads in advance.

4. For the selection of solder paste, it is best to use LED-specific solder paste from each solder paste manufacturer, and with the correct furnace temperature curve, the soldering effect will be more reliable.

5. Relevant measures such as LED anti-sulfurization must also be implemented to prevent LEDs from coming into contact with all sulfur-containing substances.