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Item | Manufacturing capability |
PCB Layers | 1-64 layers |
Quality grade | IPC Class 2/ IPC Class 3 |
Laminate/Base material | FR4/High TG/ PTFE/ S1141/Ceramic PCB/ Polyimide/ FR406/ IT180A/ Isola-FR408HR/ Rogers/ Taconic/ Arlon/ Halogen free etc |
Brand of laminate | Kingboard/ ITEQ/ Shengyi/Nanya/Isola/ TUC/ SYL/ Arlon/ Nelco/ Tacnoic/ Hitachi/ Rogers etc |
High tempature material | Normal Tg: Shengyi S1141/KB6160/Huazhen H140(not suitable for lead free process) Middle TG: For HDI,multilayers: SY S1000-2/ITEQIT158/HuazhengH150/TU-662/SY S1150G/HuazhenghH150HF/H160HF High TG:For thick copper,high layers: SY S1000-2/ITEQIT 180A/HuazhengH170/Isola:FR408R/370HR/TU-752/SY S1165 |
High frequency circuit board material | Rogers/Arlon/ Taconic/SY SCGA-500/S7136/HuazhengH500 |
High speed PCB Material | SY S7439/ TU-872 SLK/ Isola:I-speed, I-Tera@MT40/Huazheng:H175/H180/H380 |
Ink | Taiyo ink, Kuangshun, Rongda, S.M Materials |
Heat conductivity for Alu.Boards | 1.0 |
PCB type and services | Rigid PCB, Flexible PCB, Rigid- flex pcb, HDI pcb, FR4 PCB, High TG PCB, Aluminum PCB, Metal core PCB, Impedance PCB,Multilayer PCB |
Board size(Max) | 600*800MM |
Board thickness | 0.1--8mm |
Board thickness tolerance | ±0.1mm/±10% |
Min base copper thickness | Outer layer:1/3oz(12um)--10oz Inner layer:1/2oz--6oz |
Max finished copper thickness | 6oz |
Min mechanical drilling hole zise | 6 mil(0.15mm) |
Min lase drilling hole size | 3mil(0.075mm) |
Min CNC Drilling hole size | 6mil(0.15mm) |
Hole wall roughness(Max) | 1.5mil |
Min trace width/spacing(inner layer) | 2/2mil(outer layer:1/3oz, inner layer:1/2oz) base copper |
Min trace width/spacing(outer layer) | 2.5/2.5mil base copper |
Min space between hole to inner layer conductor | 6 mil |
Min space between hole to outer layer conductor | 6 mil |
Min annular ring for via | 3 mil |
Min annular ring for component hole | 5 mil |
Min BGA diameter | 8 mil |
Min BGA pitch | 0.4mm |
Min finished hole size | 0.15mm(CNC)/0.1mm( Laser) |
Half hole diameter | Minimum half Diameter:1mm, Half hole is a special technology, so half holediameter would be larger than 1mm |
Hole wall copper thickness(Thinnest) | ≥0.7mil |
Hole wall copper thickness (Average) | ≥0.8mil |
Min Air Gap | 0.07mm(3mil) |
Max aspect ratos | 20:01 |
Min soldermask bridge width | 3mil(0.075mm) |
Soldermask/circuit processing | Film/LDI |
Min thickness for insulating layer | 2 mil |
Max PTH(Round hole) | 8mm |
Max.PTH(Round slot holes) | 6--10mm |
PTH Deviation(Width) | ±4mil |
PTH Deviation(Length) | ±5mil |
NPTH Deviation | ±2mil |
NPTH Deviation(Width) | ±3mil |
NPTH Deviation(Length) | ±4mil |
Hole position deviation | ±3mil |
Character Types | Serial number/Barcode/QR code |
Distance between Trace and Outline | ≥0.3mm(12mil), Ship as individual boards:Distance between Trace and outline ≥ 0.3mm, Ship as Panlized boards with V-cut:Distance between Trace and V-cut ≥0.4mm |
Panelization without spacing | 0mm, ship as panelized boards and the space between boards is 0mm |
Panelization with spacing | 1.6mm, make sure the spacing between boards shoule be ≥1.6mm, otherwise it will be hard to process routing |
Surface finishing | OSP/HASL/Hasl lead free, Immersion gold,immersion silver,immersion Tin, ENEPIG, Golden finger+Hasl, ENIG+OSP,ENIG+Golden finger etc |
Soldermask colors | Green, Red, White, Black, Blue, Yellow etc |
Silkscreen colors | White, Black, Yellow etc |
Electrical testing | Flying probe test, E-test |
Other test | X-ray, AOI, Impedance control test, Solderability test etc |
Profile | 1. CNC Routing(±0.1mm) 2. CNC V-cut(±0.05mm) 3. Bevelling |
Special capabilities | Gold finger, blind and burried hole, semi-hole, plated board edge, via in pad, non-conductive resin plug hole, coil pcb, impedance control PCB etc. |
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Tel: +8615889594075
www.pcba-boards.com
Email: sales@pcba-board.com
Whatsapp: +8615889694075