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PCB Assembly capability | ||
Project | Mass production capability | Small batch production capability |
SMT testing equipment | X-ray Nondestructive tester, First piece tester, AOI Automatic Optical tester, ICT tester, BGA reworker station | |
DIP plug in production capability | 30000 points/day | |
Number of layers(Max) | 1--18 | 1--30 |
Plate Type | FR-4, Ceramic sheet, Aluminum, Halogen Free, High TG sheet | PTFE, PPO, PPE |
Sheet Mixing | 4 layers-6 layers | 6 layers-8 layers |
Biggest size | 610mm x 1100mm | / |
Dimensional accuracy | ±0.13mm | ±0.10mm |
Plate thickness range | 0.2mm--6mm | 0.2mm--8mm |
Thickness tolerance(t≥0.8mm) | ±8% | ±5% |
Thickness tolerance(t<0.8mm) | ±10% | ±8% |
Media thickness | 0.076mm--6.00mm | 0.076mm-6.00mm |
Minimum line width | 0.1mm | 0.075mm |
Minimum spacing | 0.1mm | 0.075mm |
Outer copper thickness | 8.75um--175um | 8.75um--280um |
Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
Drilling hole diameter(Mechanical drill) | 0.25mm--6mm | 0.15mm--0.25mm |
Hole diameter (Mechanical drill) | 0.2mm--6mm | 0.1mm-0.2mm |
Hole tolerance(Mechanical drill) | 0.075mm | 0.05mm |
Laser Drilling Aperture | 0.1mm | 0.075mm |
Plate Thickness aperture ratio | 10:01 | 12:01 |
SolermaSk type | Green, Black, Red, Blue, Yellow, | Green, Black, Red, Blue, Yellow |
Minimum soldermask bridge width | 0.1mm | 0.075mm |
Minimum soldermask Isolation ring | 0.05mm | 0.025mm |
Plug hole diameter | 0.25mm--0.6mm | 0.6mm-0.8mm |
Impedance tolerance | ±10% | ±5% |
Surface Treatment Type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold,chemcial immersion tin, gold finger card board | Immersion Tin, OSP |
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Tel: +8615889594075
www.pcba-boards.com
Email: sales@pcba-board.com
Whatsapp: +8615889694075